product presentation：High thermal conductivity silicon nitride substrates were made from specially designed formulation and through a strictly controlled sintering process. High thermal conductivity (>80 W/m·K), high flexural strength (>600MPa) and high fracture toughness (>6.0MP·m^1/2) made this materials the best choice as substrate for the next-generation power electronics, which can be widely used in electric vehicles, high-speed trains, renewable energies and etc.